Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

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Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

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ژورنال

عنوان ژورنال: Nanoscale Research Letters

سال: 2017

ISSN: 1931-7573,1556-276X

DOI: 10.1186/s11671-017-2037-5